{"product_id":"power-adhesives-tecbond-7786-high-temperature-polyamide-hot-melt-12-15-mm","title":"Power Adhesives Tecbond 7786 High Temperature Polyamide Hot Melt 12\/15 mm","description":"\u003cp dir=\"auto\" class=\"PDq2pG_selectionAnchorContainer\"\u003e\u003cstrong\u003ePower Adhesives Tecbond 7786 hot melt adhesive\u003c\/strong\u003e is a high- and low-temperature-resistant \u003cstrong\u003epolyamide hot melt adhesive\u003c\/strong\u003e designed primarily for low-volume overmoulding and product assembly applications in the electronics industry. It provides excellent bonds to light-gauge metals, printed circuit boards (PCBs) and many plastics, including \u003cstrong\u003ePVC and ABS\u003c\/strong\u003e.\u003cspan class=\"PDq2pG_selectionAnchor\"\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp dir=\"auto\"\u003e\u003cstrong\u003eTecbond 7786\u003c\/strong\u003e combines high and low-temperature resistance with very high molten tack. When the substrates are compressed together, the adhesive provides an almost instant grab, helping components remain securely positioned during assembly. Its open time is \u003cstrong\u003eless than 10 seconds\u003c\/strong\u003e.\u003c\/p\u003e\n\u003cp dir=\"auto\"\u003eThe adhesive is available in \u003cstrong\u003e12 mm and 15 mm\u003c\/strong\u003e formats and has an application temperature of \u003cstrong\u003e180–215°C\u003c\/strong\u003e. Its black colour, polyamide chemistry and rapid initial grab make it suitable for professional manufacturing processes where fast component positioning and resistance to temperature extremes are required.\u003c\/p\u003e\n\u003cp dir=\"auto\"\u003eFor maximum shelf life, the manufacturer recommends keeping Tecbond 7786 in its original packaging and storing it away from direct sunlight.\u003c\/p\u003e\n\u003cp dir=\"auto\"\u003e\u003cstrong\u003eTechnical Specifications\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eBrand: \u003cstrong\u003ePower Adhesives\u003c\/strong\u003e\n\u003c\/li\u003e\n\u003cli\u003eProduct: \u003cstrong\u003eTecbond 7786\u003c\/strong\u003e\n\u003c\/li\u003e\n\u003cli\u003eType: high-temperature-resistant hot melt adhesive\u003c\/li\u003e\n\u003cli\u003eChemistry: \u003cstrong\u003epolyamide\u003c\/strong\u003e\n\u003c\/li\u003e\n\u003cli\u003eSizes: \u003cstrong\u003e12 mm and 15 mm\u003c\/strong\u003e\n\u003c\/li\u003e\n\u003cli\u003eColour: black\u003c\/li\u003e\n\u003cli\u003eOpen time: \u003cstrong\u003eless than 10 seconds\u003c\/strong\u003e\n\u003c\/li\u003e\n\u003cli\u003eApplication temperature: \u003cstrong\u003e180–215°C\u003c\/strong\u003e\n\u003c\/li\u003e\n\u003cli\u003eMolten tack: very high\u003c\/li\u003e\n\u003cli\u003eSuitable substrates: light-gauge metal - PCB - PVC - ABS - many plastics\u003c\/li\u003e\n\u003cli\u003ePrimary applications: low-volume overmoulding - product assembly\u003c\/li\u003e\n\u003cli\u003eIndustries: electronics - industrial manufacturing\u003c\/li\u003e\n\u003cli\u003eStorage: original packaging away from direct sunlight\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp dir=\"auto\"\u003e\u003cstrong\u003eKey Features\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003ePolyamide hot melt adhesive\u003c\/strong\u003e with high and low-temperature resistance\u003c\/li\u003e\n\u003cli\u003eDesigned primarily for electronics applications\u003c\/li\u003e\n\u003cli\u003eSuitable for low-volume overmoulding\u003c\/li\u003e\n\u003cli\u003eSuitable for industrial product assembly\u003c\/li\u003e\n\u003cli\u003eVery high molten tack\u003c\/li\u003e\n\u003cli\u003eAlmost instant grab when substrates are compressed\u003c\/li\u003e\n\u003cli\u003e\u003cstrong\u003eOpen time of less than 10 seconds\u003c\/strong\u003e\u003c\/li\u003e\n\u003cli\u003eApplication temperature of \u003cstrong\u003e180–215°C\u003c\/strong\u003e\n\u003c\/li\u003e\n\u003cli\u003eExcellent bonding to light-gauge metals and PCBs\u003c\/li\u003e\n\u003cli\u003eSuitable for \u003cstrong\u003ePVC, ABS\u003c\/strong\u003e and many other plastics\u003c\/li\u003e\n\u003cli\u003eAvailable in \u003cstrong\u003e12 mm and 15 mm\u003c\/strong\u003e formats\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp dir=\"auto\"\u003e\u003cstrong\u003eApplications \u0026amp; Usage\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp dir=\"auto\"\u003e\u003cstrong\u003eTecbond 7786 high-temperature hot melt adhesive\u003c\/strong\u003e is designed primarily for low-volume overmoulding and industrial product assembly in the electronics industry. It can be used for bonding light-gauge metals, \u003cstrong\u003eprinted circuit boards (PCBs)\u003c\/strong\u003e and a range of plastic components.\u003c\/p\u003e\n\u003cp dir=\"auto\"\u003eIts very high molten tack provides an almost instant grab when substrates are compressed together. Combined with an open time of less than 10 seconds, this makes Tecbond 7786 suitable for production processes requiring rapid component fixing.\u003c\/p\u003e\n\u003cp dir=\"auto\"\u003eThe adhesive is applied at \u003cstrong\u003e180–215°C\u003c\/strong\u003e. For maximum shelf life, it should be stored in its original packaging away from direct sunlight.\u003c\/p\u003e\n\u003cp dir=\"auto\"\u003e\u003cstrong\u003eAdvantages\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eDesigned for applications involving high and low temperatures\u003c\/li\u003e\n\u003cli\u003eVery high molten tack provides rapid initial grab\u003c\/li\u003e\n\u003cli\u003eLess than 10-second open time supports fast assembly processes\u003c\/li\u003e\n\u003cli\u003eSuitable for low-volume electronics overmoulding\u003c\/li\u003e\n\u003cli\u003eExcellent bonding to PCBs and light-gauge metals\u003c\/li\u003e\n\u003cli\u003eSuitable for PVC and ABS\u003c\/li\u003e\n\u003cli\u003eBonds many plastics used in product assembly\u003c\/li\u003e\n\u003cli\u003eAvailable in both 12 mm and 15 mm formats\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp dir=\"auto\"\u003e\u003cstrong\u003eApplications \/ Industries\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eElectronics industry\u003c\/li\u003e\n\u003cli\u003eElectrical and electronic component assembly\u003c\/li\u003e\n\u003cli\u003eLow-volume overmoulding\u003c\/li\u003e\n\u003cli\u003ePCB applications\u003c\/li\u003e\n\u003cli\u003eIndustrial manufacturing\u003c\/li\u003e\n\u003cli\u003eProduct assembly\u003c\/li\u003e\n\u003cli\u003eLight-gauge metal bonding\u003c\/li\u003e\n\u003cli\u003ePVC component bonding\u003c\/li\u003e\n\u003cli\u003eABS component bonding\u003c\/li\u003e\n\u003cli\u003ePlastic component assembly\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Power Adhesives","offers":[{"title":"Default Title","offer_id":59541033812313,"sku":"7786FR\/12\/250","price":0.0,"currency_code":"PLN","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0923\/0997\/9481\/files\/7786FR-15-250-1-7774b503_92192972-02c5-466b-8ab1-0a1472637dbd.webp?v=1790106750","url":"https:\/\/ott-polski.manta.link\/en\/products\/power-adhesives-tecbond-7786-high-temperature-polyamide-hot-melt-12-15-mm","provider":"Ottensten","version":"1.0","type":"link"}